Abstract
Electromigration will induce polarity effects on the formation and dissolution of intermetallic compounds (IMCs) at the electrodes in conventional solder joints. However, the entire solder joint of a microbump may convert to intermetallic compounds after prolonged current stressing. The present study investigated the growth behavior of intermetallic compounds in a 30 μm height Sn1.8Ag microbump plated on a Cu pillar with or without an intermediate Ni layer when the substrate metallization was either Organic Solderability Preservative-Cu (OSP-Cu) or Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG). The progress of the growth of the intermetallic compounds under a current density of 1.0 × 104 A/cm2 was investigated for up to 300 h. The segregation and growth of the intermetallic compounds revealed by a three-dimensional cross section during current stressing was observed and discussed.
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