Abstract
In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMCs) formation of solder joints made from lead–free Sn–4Ag–0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG), immersion silver (ImAg) and copper surface finishes are presented. After the first reflow soldering, the well–known intermetallic Cu6Sn5 was observed in ImAg and Copper of surface finishes. While for ENEPIG and ENIG, mainly, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was formed respectively. By increasing the number of reflows up to three, the thickness of intermetallics increased gradually and their grain sizes coarsened. The intermetallics growth kinetics showed that the interfacial phase Cu6Sn5, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was controlled mainly by grain boundary diffusion and that the intermetallic growth on ENEPIG was found to be slowest among other surface finishes being used.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of Microstructure and Materials Properties
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
