Current conduction mechanisms through thin tunnel oxide during erase operation of flash electrically erasable programmable read-only memory devices

Abstract

The mechanism of current conduction through thin tunnel oxide during erase operation of flash electrically erasable programmable read-only memory devices has been studied both theoretically and experimentally. The floating gate (FG) leakage current measured between 25 and 300 °C and at oxide fields ranging from 6 to 10 MV/cm is primarily attributed to Poole–Frenkel (PF) emission of trapped electrons from the electron traps located at about 1.0 eV below the silicon dioxide conduction band in addition to Fowler–Nordheim (FN) tunneling of electrons from the degenerately doped n-type polycrystalline silicon (n+-polySi) FG. It is observed that PF emission current IPF dominates FN electron tunneling current IFN at oxide electric fields Eox between 6 and 10 MV/cm and throughout the temperature range studied here. The observed thickness dependence of FG leakage current at a given applied oxide field arises due to different electron trap concentrations in the oxide. A physics based new temperature dependent analytical formula has also been developed for FN tunneling of electrons from the accumulation layer of semiconductors. In addition, the authors present theoretical results showing the effect of the FG doping concentration on the leakage current.