Abstract
To meet the upcoming challenges of higher power density and higher efficiency for power electronics, a system level approach to the design of power electronic devices must be carried out. Higher system integration and packaging will allow for more compact designs but will also result in challenges for component manufacturing and thermal management. Additive manufacturing can potentially mitigate some of these challenges due to the design flexibility and intricate features that additive manufacturing methods can provide. This paper presents an overview of the additive manufacturing technologies currently in practice at the academic and industry level. A detailed review is presented of current applications of additive methods for the production of power electronic components, advanced heat exchanger designs and integrated power electronic systems.
Highlights
As global trends in energy consumption continue to rise [1], there is a corresponding demand to exceed the current power, weight reduction, and efficiency limitations in technology sectors such as electrified transportation
wide band-gap (WBG) devices will require advanced thermal management (TM), reduced package sizes and integrated solutions to meet operational conditions [7], but current manufacturing methods are limited in geometric freedom, manufacturability, high turnover times and material selection
ADDITIVE MANUFACTURING METHODS According to the ISO/ASTM52900 - 15 Standard [3], Additive Manufacturing (AM) can be classified into seven distinct methods: Material Extrusion, Vat Photopolymerization, Powder Bed Fusion, Direct Energy Deposition, Binder Jetting, Material Jetting and Sheet Lamination
Summary
As global trends in energy consumption continue to rise [1], there is a corresponding demand to exceed the current power, weight reduction, and efficiency limitations in technology sectors such as electrified transportation. AM processes can currently be implemented in several applications including the transportation industry For automotive technologies such as power electronics, the demand for power modules and converters with higher efficiency and power density are increasingly challenging to meet. WBG devices will require advanced thermal management (TM), reduced package sizes and integrated solutions to meet operational conditions [7], but current manufacturing methods are limited in geometric freedom, manufacturability, high turnover times and material selection. The packaging and material selection for passive component manufacturing for power electronics is limited by conventional methods [8], [9], but with the implementation of AM, more efficient inductors with higher inductance capabilities are possible. The following sections individually present current AM solutions and technologies for distinct aspects of power electronics: design and manufacturing of passive components, TM solutions and higher system integration and packaging. A conclusion is made, stating the necessity of AM to penetrate various solutions for power electronics to meet future performance and volume requirements at large scale production
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