Abstract
Cryptomeria japonica (Japanese cedar) wood was liquefied using polyethylene glycol (PEG-400 and PEG-600)/glycerol as the solvent with H2SO4 as a catalyst. The blended epoxy resins were prepared by mixing the liquefied wood with epoxy resin of various weight ratios and used for wood gluing. The results showed that blended epoxy resins could cure under room temperature with an exothermic reaction. DSC thermoanalysis showed that increasing the blending amount of liquefied wood would shift the peak of curing reaction to a higher temperature but with less heat released. Blended epoxy resins had a good dry bonding strength for wood when cured at room temperature. However, curing with heat treatment could improve the wet bonding strength of blended epoxy resins, especially for those prepared with PEG-400-liquefied wood.
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