Cure processing modeling and cure cycle simulation of epoxy‐terminated poly(phenylene ether ketone). I. DSC characterization of curing reaction

Abstract

The curing reaction process of epoxy-terminated poly(phenylene ether ketone) (E—PEK) with 4,4′-diaminodiphenyl sulfone (DDS) and hexahydrophthalic acid anhydride (Nadic) as curing agents was investigated using isothermal differential scanning calorimetry (IDSC) and nonisothermal differential scanning calorimetry (DDSC) techniques. It was found that the curing reactions of E—PEK/DDS and E—PEK/Nadic are n th-order reactions but not autoaccelerating. The experimental results revealed that the curing reaction kinetics parameters measured from IDSC and DDSC are not equivalent. This means that, in the curing reaction kinetics model for our E—PEK system, both isothermal and nonisothermal reaction kinetics parameters are needed to describe isothermal and nonisothermal curing processes. The isothermal and nonisothermal curing processes were successfully simulated using this model. A new extrapolation method was suggested. On the basis of this method the maximum extent of the curing reaction (Ault) that is able to reach a certain temperature can be predicted. The Ault for the E—PEK system estimated by the new method agrees well with the results obtained from another procedure reported in the literature. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 66: 789–797, 1997