Abstract
Copper electrodeposition is a central process in the metallization of microelectronics and more recently copper has also found use as an important electrocatalyst in the conversion of CO2 to hydrocarbons. Gaining mechanistic insight into the reactivity of Cu surfaces requires in situ and better still in operando measurements. Herein the utility of the combination of vibrational spectroscopy (SEIRAS, SHINERS), electrochemical mass spectrometry (EC-MS) and scanning tunneling microscopy (ECSTM) to examine the competitive and co-adsorption interactions between potential dependent halide adsorption, molecular adsorption, underpotential metal deposition and hydride formation on low index Cu single crystals surface will be detailed. Further still, the emergent opportunity to study the impact of such interaction on metal deposition reactions will also be explored.1.Raciti and T.P. Moffat, “Quantification of Hydride Coverage on Cu(111) by Electrochemical Mass Spectrometry,” J. Phys. Chem., 126, 18734-18743 (2022).2.Raciti, A.R. Hight Walker, T. P. Moffat, “Mapping Surface Chemistry During Superfilling with Shell- Isolated Nanoparticle Enhanced Raman Spectroscopy and X-ray Photoelectron Spectroscopy,” J. Electrochem. Soc., 169, 082506 (2022).3.B.M. Tackett, D. Raciti, A.R. Hight Walker, T.P. Moffat, “Surface Hydride Formation on Cu (111) and its Decomposition to Form H2 in Acid Electrolytes,” J. Phys. Chem. Lett., 12, 10936-10941 (2021).4. G.Liu, S. Zou, D. Josell, L.J. Richter and T.P. Moffat, “SEIRAS Study of Chloride Mediated Polyether Adsorption on Cu,” J. Phys. Chem. C., 122, 21933-21951, (2018).
Published Version
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