Abstract

Copper ion-implanted stainless steel possesses antibacterial properties and resistance to corrosion and wear. These properties have been found beneficial in surgical implants where stainless steel has a profound use. Simulations have been performed using SRIM (Stopping and Range of Ions in Matter) software, where copper ions were implanted into stainless steel substrate. The results were obtained in terms of different plots of collision events, ion range, ionization, lateral range distribution of ions, and energy loss to phonons concerning target depth. The morphology of copper deposited on Si by sputtering techniques was observed which is a technologically important system.

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