Cu/Diamond composite heat-conducting shims

Abstract

Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 – 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 – 650 W·m-1·K-1. The coefficient of thermal expansion CTE was measured and is 5.5 – 7.5 · 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.