Abstract
C-mode acoustic microscopy provides unique advantages over SLAM techniques in detecting microcracks, voids, and delaminations. The reliability of integrated circuit (IC) packages depends in many respects on their mechanical integrity. The effect of structural weaknesses caused by poor bonding, voids, microcracks or delaminations may not be evident in the electrical performance characteristics, but may cause premature failure. C-mode scanning acoustic microscopy (C SAM) is an excellent tool for non-destructive failure analysis of IC packages. It provides a rapid and comprehensive imaging of critical package defects and the location of these defects in three dimensions within the package. >
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