Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints

Abstract

The elastic and plastic anisotropy of the tin phase in a Pb-free tin-based solder joint has a very important effect on the reliability of solder joints. The crystal plasticity finite-element (CPFE) method takes into account the effect of anisotropy, and it can be used to solve crystal mechanical deformation problems under complicated external and internal boundary conditions imposed by inter- and intragrain micromechanical interactions. In this study, experimental lap-shear test results from the literature are used to calibrate the CPFE model. The spatial neighbor orientation relationships of the crystals were assessed by studying four different sets of orientations using a very simple model to establish a basis for further development of the model. Average shear strain and Schmid factor analyses were applied to study the activity of slip systems. Further optimization of model parameters using comparisons with experiments will be needed to identify more suitable rules for stress evolution among the 10 slip systems in Sn. By suppression of some of the slip systems the CPFE model is able to simulate heterogeneous deformation phenomena that are similar to those observed in experiments. This work establishes a basis for an incremental model development strategy based upon experiments, modeling, and comparative analysis to establish model parameters that could predict the slip processes that lead to damage evolution in lead-free solder joints.