Abstract
ABSTRACT Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.
Highlights
With the rapid development of the electronics industry, electronic products are gradually turning to miniaturization and multi-functionality
Electronic packaging technology is the technical basis of system packaging technology, providing electronic and mechanical connections and protection for electronic chips [1]
Zhang et al [61] analyzed the stress-strain response of lead-free solder joints of wafer level chip scale packaging (WLCSP) devices under thermal cycling load and predicted the fatigue life of solder joints by finite element method (FEM) simulation
Summary
With the rapid development of the electronics industry, electronic products are gradually turning to miniaturization and multi-functionality. With the rapid development of electronic packaging technology, the thermal and mechanical loads that solder joints need to withstand exceed the maximum allowable, and the performance requirements for brazing are gradually increasing. Traditional tin-lead solder can not meet the requirements of the electronics industry and require the development of high-performance lead-free solder materials [3]. It is critical to study solder joint reliability during service in these specific environments, so as to judge the life of electronic products. This paper reviews the research progress on solder joint reliability of lead-free solder joints, discusses the impact of temperature, vibration, tin whisker and electromigration on solder joint reliability, and provides a further theoretical basis for the study of solder joint reliability of electronic products in service
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