Abstract
A /spl pi/ technology (particle-enhanced isolation, PEI) is proposed to employ penetrating proton beams on the already manufactured mixed-mode (analog-digital) IC wafers (prior to packaging) for the suppression of undesirable substrate coupling. Results indicated that an improvement of 25-30 dB could be achieved by applying a relatively low-fluence proton bombardment on the isolation-intended region in a metal pads pattern. Hall measurements of the irradiated spots were conducted and the associated physics are elaborated on. Issues relevant to the commercial-scale implementation of this technology are also pointed out and discussed. Finally, a /spl pi/-technology-based post-very large scale integration (VLSI) concept: the particle-beam stand (PBS) is promoted, which, especially with its design rules pushed to the front end, can potentially serve as the general system-on-a-chip (SOC) integration platform and end most mixed-mode and RF SOC development difficulties.
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