Abstract
The synthesis of a low dielectric constant polyimide (PI) with a polyhedral oligomeric silsesquioxane (POSS) cross-linked structure is presented. A non-planar conjugated diamine monomer (FSNH2) with two -CH=CH2 reactive groups was first synthesised in a two-step process, and then two polyimides were synthesized by PSS-Octavinyl (OVPOSS) substituted, FSNH2 and dianhydride. OVPOSS cross-linked polyimides have good thermal stability and low dielectric constant. 6FDA-FSNH2-OVPOSS(6FPI-3) can reach a minimum dielectric constant of 2.08 (108 Hz) and a dielectric loss of 0.008 (108 Hz). In addition, the cross-linked structure of the OVPOSS and polyimide chains prevents the agglomeration of OVPOSS to a certain extent and improves the tensile strength and elongation at break of the polyimides, which has great application potential in large-scale integrated circuits.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
