Creep in pure and two phase nickel-doped alumina

Abstract

Creep in pure and two phase nickel-doped alumina has been investigated in the stress range 0.70 to 4.57 kgf mm−2 (1000 to 6500 psi), and temperature range 1450 to 1800° C, for grain sizes from 15 to 45 μm (pure alumina) and 15 to 30 um, (nickel-doped alumina). The effect of stress, grain size and temperature on the creep rate suggests that diffusion controlled grain-boundary sliding is the predominant creep mechanism at low stresses and small grain sizes. However, the stress exponents show that some non-viscous boundary sliding occurs even at the lowest stresses investigated. This mechanism is confirmed by metallographic evidence, which shows considerable boundary corrugation in the deformed aluminas. At higher stresses and larger grain sizes the localized propagation of microcracks leads to high stress exponents in the creep rate equation. The nickel dopant, which introduces an evenly distributed spinel second phase into the alumina matrix, increases the creep rate and enhances boundary sliding and localized crack propagation. The weakening effect of the second phase increases with grain size, and tertiary creep occurs at strains of 0.5% and below in large grained material.