Abstract
This paper studies the creep and creep rupture properties of Sn-95 Pb solder. Creep and creep rupture tests were carried out using Sn-95 Pb solder specimens at 313 K, 353 K and 398 K to develop a creep constitutive equation and rupture time equation. There were clear short primary, long tertiary and steady creep stages in Sn-95 Pb solder at the three temperatures. A creep constitutive equation was proposed as a function of stress and temperature. The proposed equation predicted the experimental creep strain within a factor of 1.25. A new equation for predicting creep rupture time was also proposed. The equation predicted the experimental rupture time within a factor of two. These results were compared with those of Sn-37 Pb solder to discuss differences resulted from melting temperature.
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