Abstract

The paper is devoted to highlighting the potential application of the quantitative imaging technique through results associated with work hardening, strain rate and heat generated during elastic and plastic deformation. The aim of the research presented in this article is to determine the relationship between deformation in the uniaxial tensile test of samples made of 1-mm-thick nickel-based superalloys and their change in temperature during deformation. The relationship between yield stress and the Taylor–Quinney coefficient and their change with the strain rate were determined. The research material was 1-mm-thick sheets of three grades of Inconel alloys: 625 HX and 718. The Aramis (GOM GmbH, a company of the ZEISS Group) measurement system and high-sensitivity infrared thermal imaging camera were used for the tests. The uniaxial tensile tests were carried out at three different strain rates. A clear tendency to increase the sample temperature with an increase in the strain rate was observed. This conclusion applies to all materials and directions of sample cutting investigated with respect to the sheet-rolling direction. An almost linear correlation was found between the percent strain and the value of the maximum surface temperature of the specimens. The method used is helpful in assessing the extent of homogeneity of the strain and the material effort during its deformation based on the measurement of the surface temperature.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.