Abstract
A fibre orientation dependent material model of the thermoset is implemented to predict the lifetime of electronic components as a part of 2nd level encapsulated packages. Experimental data are used in combination with coupled simulations (process simulation – fibre orientation dependant material model – thermo-mechanical simulation) for defining this lifetime prediction model. An already existing lifetime prediction model based on the Coffin-Manson relation is used initially to evaluate the prediction accuracy. The prediction model is then adjusted and fitted for the current application.
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