Abstract
Press-pack IGBTs gradually replaces the conventional soldering IGBT modules in high power and high voltage application, however, the research on its reliability and lifetime prediction is much less mature. FEM is an effective method to analyze the reliability of press-pack IGBT. Some of the simulations used FEM are summarized in this paper, and the result of FEM can be used in lifetime prediction of presspack IGBTs. The lifetime prediction models are analyzed, which can be divided into analytical models and physical models. The analytical models are all empirical model and the physical models are based on the physical and chemical properties of the materials. Some lifetime predictions of presspack IGBTs based on FEM software are summarized. Based on the lifetime prediction model and some parameters such as pressure, the lifetime of press-pack IGBT can be calculated, and shown in the lifetime distribution diagram.
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