Abstract
Screen-printed ferroelectric BST thick films were co-fired inside a LTCC substrate by employing pressure-assisted sintering (PAS). Sintering pressure and time were varied and their effect on the microstructure and dielectric properties of the film was studied. Sintering conditions for the fabrication of buried BST thick films were experimentally defined and parallel plate capacitors were successfully fabricated inside a LTCC substrate. The relative permittivity ( ɛ r) of the films at 10 kHz varied from 188 to 220 depending on the sintering conditions, and the maximum tunability of the films was 44% (5.7 V/μm). The measured loss tangent (tan δ) at zero bias was 0.005.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
