Abstract
We have proposed an equation for calculating the mean temperature of the wall of a copper channel depending on the heat-flux density and solution velocity in the channel. We have assumed that the formation of corrosion products on copper and in the solution includes reactions leading to the appearance of complex compounds of copper with components of the solution as well as of solvated and desolvated oxides, and the shift of dynamic equilibrium in these reactions depends on the temperature of the copper surface. Under conditions of the ion-exchange purification of 66% ethylene-glycol solution, the coefficient of protective action (Z) decreases with increase in the heat-flux density and the corresponding growth of the temperature of the copper surface. A decrease in the rate of copper dissolution (Z > 40%) can be reached in 66% ethylene-glycol solution with a specific electric resistance of 25 kΩ·m and a concentration of dissolved oxygen of 0.9–1 g/m3.
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