Abstract
AbstractTwo complexing agents, glycine and citric acid, in hydrogen peroxide based slurries for planarizing copper have been compared. Copper dissolution and polish rates and in situ electrochemical experimental results at various slurry pH values and hydroxyl radical concentrations at pH=8.4 are presented. It was observed that the pH of the slurry has a strong influence on copper dissolution and polish rates. While high copper removal rates were observed with citric acid-peroxide solutions at low pH values, glycineperoxide system yielded high Cu removal rates at alkaline pH values. Copper dissolution rates in both the systems at pH 4 and 8 were consistent with the electrochemical measurements. The concentration of hydroxyl radicals generated in citric acid-peroxide system was less than that of those generated in glycine peroxide system at pH=8.4 indicating low copper removal rates at alkaline conditions in the former system.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
