Abstract
The transient liquid phase diffusion bonding (TLP-DB) was employed to join TiNi shape memory alloy (SMA) and stainless steel (SS) with an interlayer metal of Ag-Cu eutectic metal foil.The corrosion behavior of the TLP-DB joint in Hanks solution at 37°C was investigated by electrochemical methods.The results show that the corrosion resistance of the joint is comparable to, but lower than that of base metals during the early anodic polarization, and the corrosion rate of the joint is between that of TiNi SMA and SS in the transpassive region at high potentials. The corrosion resistance of the specimens in Hanks' solution is associated with the surface quality, mircotructure and the intermetallics. Both TiNi SMA and SS display the characteristics of localized corrosion with a little pitting corrosion, while the joints mainly show the characteristics of pitting corrosion concentrated on the enrichment Cu phases.
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