Copper-Lead Alloys from Ethylene Diamine Solution

Abstract

Copper‐lead alloys that are bright, solid, brittle and adherent have been successfully electrodeposited at 9° C. from a 7.2% ethylene diamine solution containing cupric oxide to the extent of 28.6 g./L. of metallic copper and plumbous hydroxide to the extent of 8.6 g./L. of metallic lead. Alloys have been deposited at current densities between 0 and 54 amp./sq. ft. (0 and 5.8 amp./dm.2) on a cathode rotating between 0 and 1,176 r.p.m. (Cathode diam. = 2.2 in. or 55.6 mm.) Cupric oxide has been prepared with a 100% solubility by roasting the basic copper carbonate. The solubility of cupric oxide in amine solution undersaturated with copper is inhibited by the presence of undissolved plumbous hydroxide during the process of dissolution. The solubility of plumbous hydroxide in an amine solution saturated with cupric oxide and undersaturated with plumbous hydroxide is inhibited by the presence of solid cupric oxide during the process of dissolution. The effects on the alloy characteristics of various additions to the bath; of the superimposition of alternating current on direct current; of low cathode voltages; of periodic contact of the plate with air; and of heat treatment have also been studied. Favorable effects on the plate were produced by adding to the bath the detergent Alkanol WXN to the extent of 1%.