Abstract
Effect of bicarbonate ions on the copper passivity and its local breakdown is studied by cyclic voltammetry, Auger spectroscopy, x-ray photoelectron spectroscopy, and scanning electron microscopy. Comparing data for solutions with various sodium bicarbonate concentrations shows copper to undergo pitting in 0.02 M NaHCO3, whereas it remains stably passive in 0.10 M NaHCO3. Independent studies suggest that carbonates play a protective role in stabilization of the oxide-hydroxide passive film on copper.
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