Abstract
Different polymer substrates were copper-plated by electroless deposition without using the Pd-based conventional catalyst to initiate the redox reaction. The principle of the process is based on the deposition of a copper(II) organic precursor film on the polymer surface to be metallized and on the reduction of the Cu(+ 2) ions. This reduction is obtained by different chemical, thermal, photonic or plasma techniques and its results were studied by XPS analysis. A polymer surface densely and homogeneously seeded with Cu(0) species allows to initiate the autocatalytic deposition of copper films. Their thickness was measured by X-ray fluorescence spectrometry and their adhesion evaluated by the Scotch® tape test.
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