Abstract
TIUS paper investigates the reliabilih impact of adding copper (Cu) to eutectic tin-lead (63Sn-37Pb) flip chip bumps. Both reflow experiments and DSC (Differential Scanning Calorimctp) analyses were used to deteniiine tlie maximnni ainount of copper that could be added to the eutectic SiPb alloy without aKecting its reflow characteristics. Based on these results. eutectic SnPb and 62Sn-37Pb-ICu were selected for further evaluation in wafer bumping. flip chip assembly. and reliabilih tests. Excellent results were observed in wafer bump fabrication and assembly of die to various hpes of substrates using the current production eutectic SnPb bumping and circuit board assembly processes. A series of rcliabilih tests? including thermal cycling. HTS (High Temperature Storage). and HTOL (High Temperature Operating Life) tests. were conducted to deteniiine tlie impact of SnPbCu bumps on flip chip reliability The one percent copper solder bumps (62Sn-37Pb-ICn) were found to have superior reliability. particularly when diffusion related failure mechanisms were involved. The copper addition incrcased tlie bump reliability by 3 fold and 10 fold in HTOL and HTS tests. respectively. However, the themial fatibqe life of the eutectic SnF'b bumps was not sensitive to tlie copper addition.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
