Convective Immersion Cooling of Parallel Vertical Plates

Abstract

Complete immersion of electronic assemblies, in fluids of appropriately high dielectric strength and low dielectric constant, offers a most promising alternative to conventional thermal control measures. The present study is aimed at providing an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.