Abstract
High power light emitting diodes (LEDs) characteristics in terms of efficiency, long operating life and reliability which has lead to its application as lighting systems. However, the high power LEDs are subjected to thermal challenges due to it high input power. This work reports simulation analysis on a single chip high power LED to where thermal performances of the LED package were evaluated under varied convection condition. The simulation was carried out using Ansys version 11. The heat dissipation evaluated and compared in terms of junction temperature, von Mises stress and thermal resistance at each respective convection condition with constant input power of 1 W.
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