Abstract

Performance of high speed digital and analog hybrid microcircuits almost always differs from the ideal circult design and from a breadboard or PC board version of the same circuit to some extent due to differences in stray effects. This paper discusses computer analysis of inductive and capacitive coupling between various thick-film microcircuit elements in both conventional and multilayer chip and wire hybrid microcircuits. Also discussed are extended circuit modeling techniques for including stray effects of a given microcircuit layout in the computer analysis of the circuit design.

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