Abstract

In high-reliability applications, DC/DC converters should realize high-efficiency and fast-transient in harsh environments. Thus, the circuit parameter design and the reliability design are both critical. The secondary-side control circuit has a faster transient and a simpler gate-drive than the primary-side control circuit, which has been used for over twenty years. However, the detailed design procedure and analysis of the high-reliability secondary-side control circuit have not been presented in the literature. This article introduces a secondary-side control circuit design and its small-signal modeling procedure with a peak-current-mode-control (PCMC) forward converter. The reliability design and evaluation for thick-film converter are demonstrated. A 100-watt prototype is manufactured, and its steady-state waveforms and transient waveforms are tested and then compared with other high-reliability products. The experimental results show that the peak efficiency reaches 90.6%; the load transient response is 330mV/560μs; and the mean-time-between-failure (MTBF) value is 481 kilo-hours, proving the fast-transient and high-reliability features of the secondary-side control circuit.

Highlights

  • With the development of electronics, the performance of power converters is multiplying

  • The state-of-the-art DC/DC power modules have high efficiency, compact size, and fast transient. They often require working at moderate temperature, moderate humidity, and fine ventilation conditions

  • High-reliability is crucial for electronic circuits

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Summary

Introduction

With the development of electronics, the performance of power converters is multiplying. The state-of-the-art DC/DC power modules have high efficiency (over 95%), compact size (over 1000 watts per cubic inch), and fast transient. They often require working at moderate temperature, moderate humidity, and fine ventilation conditions. Aerospace, and military applications, the electronic equipment should endure extreme operating conditions, such as extreme temperature, high humidity, ionizing radiation, or severe physical shock [1]–[3]. Companies and institutions set specifications for designing and manufacturing high-reliability components and circuits. MIL-PRF-38534 is used for hybrid integrated circuit design [4], MIL-STD-883 for microcircuits test [5], and MIL-STD-975 for component derating design [6].

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