Abstract
Abstract With the rapid development of electronic engineering and nanotechnology, the electrical field-induced surface migration plays an increasingly important role in the fields of materials science. By comparing the changes in the surface migration behavior of gold nanogap electrodes under different electric field parameters, we reveal the kinetic processes and influencing factors of electric field-induced surface migration. Under the condition of only 1 pA current limit, under the continuous electric field, the hillcok only appears in the anode and gradually evolve into multiple peaks when rises to some extent. By establishing a finite element model of the nanogap, we find the hillock grows under the field strength gradient. Then hillock growth is biregulated by applying a positive or negative voltage to the drain end of the gap device. Located in the normal temperature atmosphere, the morphology will degenerate, and this feature is opposite to the hillock generated by electromigration.
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