Abstract
Contribution of Mechanical Activation on the Growth of Intermetallic Compound Layers at the Cu/Al Interface During Vacuum Hot Pressing
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https://doi.org/10.1007/s12666-022-02578-6
Publication Date: Apr 6, 2022 | |
Citations: 1 |
Contribution of Mechanical Activation on the Growth of Intermetallic Compound Layers at the Cu/Al Interface During Vacuum Hot Pressing
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