Contribution from dislocation to deformation resistance in polycrystals of copper-based solid solutions

Abstract

The evolution of dislocation structure in solid solutions of Cu-Al and Cu-Mn systems with different grain sizes and at different test temperatures is studied by means of transmission electron diffraction microscopy. The scalar density of dislocations is measured and its relationship to the flow stress of alloys is determined. Changes in the contribution from dislocation hardening to deformation resistance upon variations in the contributions associated with changes in grain size, solid-solution hardening, and test temperature are analyzed.