Abstract
Abstract Aluminum (Al) wire has certain limitations and cannot satisfy the increased demands for power electronics interconnects. Copper (Cu) wire has many benefits and is replacing Al wire in high power, high temperature applications. Cu wire is much harder and wears the bond tool much faster than Al wire. Consumable lifetime and process stability have to be improved so that Cu wire interconnect can be accepted for mass production. The bond tool wear mechanism is investigated. Bond process parameter, bond tool tip geometry, and bond tool material affect bond tool lifetime and bond performance. By combining the bond tool tip design and bond process optimization, an ultra-shallow groove bond tool that has a groove depth (GD) of 40% wire diameter achieved producing 260,000 Cu wire bonds. The groove opening angle (GOA) affects wire confine capability of a bond tool and a larger GOA is preferred for bond tools with a shallower GD. Alternative bond tool material shows benefits of improving bond appearance and further extending bond tool lifetime.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
