Abstract
Wire bond interconnection technologies play a fundamental part in current highly integrated microelectronic device. In this paper, the mechanical harmonic effects on gold, copper and aluminium wire interconnection adhesion integrity were investigated as it is getting more attention in terms of reliability considerations. The gold (Au), copper (Cu) and aluminium (Al) wire were utilized in this study for harmonic response comparison purpose. The wire bond interconnection models are subjected to a constant loading pressure in X-axis and Y-axis direction. ANSYS Version 11.0 was employed for the modal and harmonic response analysis simulation process. Understanding the basics and fundamentals of harmonic response analysis are very important in order to prevent the maximum amplitude which leads to wire bond failure. The results determined that copper wire has the most reliable interconnection adhesion integrity compared to aluminium and gold wire due to differences in the material properties of the wire.
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