Construction and Performance of a Double-Sided Silicon Detector Module Using the Origami Concept

Abstract

The APV25 front-end chip with short shaping time will be used in the Belle II Silicon Vertex Detector (SVD) in order to achive low occupancy. Since fast amplifiers are more susceptible to noise caused by their capacitive input load, they have to be placed as close to the sensor as possible. On the other hand, material budget inside the active volume has to be kept low in order to constrain multiple scattering. We built a low mass sensor module with double-sided readout, where thinned APV25 chips are placed on a single flexible circuit glued onto one side of the sensor. The interconnection to the other side is done by Kapton fanouts, which are wrapped around the edge of the sensor, hence the name Origami. Since all front-end chips are aligned in a row on the top side of the module, cooling can be done by a single aluminum pipe. The performance of the Origami module was evaluated in a beam test at CERN in August 2009, of which first results are presented here.