Abstract
Cu-Sn powders are promising alternatives to Ag and Au in applications including printed electronics because of their low cost and high oxidation resistance. Further development requires knowledge of the conductivity of their corresponding one- and two-dimensional structures. Herein, CuSny (y = atom ratio of Sn/Cu) wires and films were produced by direct printing. In situ measurements of structural resistivities with variation of the temperature from 2 to 400 K in oxygen-free conditions revealed that CuSn0.1 wires have resistivities comparable to those of Cu wires. Furthermore, CuSn0.1 films exhibited significantly lower resistivity increases after being heated at 573 K in ambient air, compared with Cu films.
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