Abstract
A method to directly deposit boron-doped amorphous carbon films via focused ion beam-assisted chemical vapor deposition is reported. The presence of boron in the deposited films was verified by X-ray photoelectron spectroscopy. Raman spectroscopy analysis confirmed the amorphousity of the films. The as-deposited films exhibited typical semiconducting behavior from electrical resistance versus temperature measurements. The presented fabrication technique is a one step process for the simultaneous deposition, boron-doping, and patterning of the films, and hence may offer an effective way to directly fabricate boron-doped amorphous carbon-based devices without the need for templates, which is highly advantageous for applications.
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