Abstract

Dislocation interactions with distributed condensed vacancy clusters in fcc metals were simulated via a concurrent atomistic–continuum method. Due to void strengthening, the dislocation lines are found to bow as a result of pinning on the original glide plane and undergo depinning through drawing out screw dipoles and forming prismatic loops on the secondary slip plane. We discovered an inertia-induced transition between Hirsch looping and void shearing mechanisms as the void spacing ranges from the scale of nm to hundreds of nm. Contrary to prior understanding, simulations suggest that large voids (∼5nm in diameter) can behave as weak barriers to dislocation motions under high strain-rate dynamic conditions.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.