Abstract
Three-dimensional natural convection flow and heat transfer were studied numerically for a heated, protruding substrate-mounted chip or package in a cubic enclosure filled with a dielectric liquid. The governing steady-state equations for the natural convection within the liquid and the conjugate conduction within the element and the substrate were solved using a finite-volume method over a wide range of Rayleigh numbers ( Ra) and substrate-to-fluid thermal conductivity ratios ( R s). Conduction through the substrate plays a dominant role in the cooling of the chip for values of R s, greater than 10. Comparison of the numerical results with experimental data showed reasonable agreement, particularly in the patterns of isotherms observed on the substrate surface.
Published Version
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