Abstract
Investigating the impact of solder joint degradation in power semiconductors is crucial given their widespread use. Solder joints, being the weakest link, are prone to multiple failure mechanisms, exacerbating degradation under normal operation. This paper presents a novel approach for assessing solder joint degradation, particularly in electric vehicles, where severe thermal and vibration stresses are prevalent. Our method categorizes solder joint conditions into discrete states, from fully perfect to fully damaged, integrating both thermal and vibration-induced failures. By considering cumulative effects, our approach yields more precise reliability estimates. Moreover, it offers a versatile framework applicable across various failure scenarios and readily deployable in the design phase.
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