Abstract

Charge trapping properties in dielectric materials serve as a ground principle in data storage devices called NAND flash. High-density nonvolatile storage requires deep trapping centers and localized trapped charge distribution. Current NAND flash technology relies on Si3N4 during the development history, and further development requires a higher dielectric constant material with compatible deep trapping centers and localized trapped charge profiles. In this work, charge trapping properties of HfxAl1−xOy dielectric layers with various compositions are investigated by modeling retention characteristics with trap energy and μτ product, where the former represents the trapping center depth and the latter represents the trapped charge profiles. Comparing the conventional Si3N4, HfxAl1−xOy dielectric layer with a low Hf content may improve long-term charge retention in NAND flash, while a localized trapped charge profile needs improvement to be compatible with Si3N4.

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