Abstract
A composite pin grid array (PGA) package was developed. This package is composed of the base, the polyimide film with the wiring paths of copper, and the cap. An attractive feature of this package is its electrical performance. Moreover, this package is suitable both for customization and for mass production at relatively low cost with reduced lead time from design to production.
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Schedule a callMore From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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