Competition between surface and strain energy during grain growth in free-standing and attached Ag and Cu films on Si substrates

Abstract

Abnormal grain growth and texture change in both free-standing and attached Ag and Cu films after annealing at 300°C for 2h have been investigated with transmission electron microscopy (TEM) and X-ray diffraction (XRD). XRD texture analysis showed that both Ag and Cu films deposited on the (001)-oriented single-crystal Si substrates had (111) and (100) double fiber textures. θ/2θ scanning XRD patterns showed that, after annealing, the free-standing Ag and Cu films showed a slight increase in the (111) texture, on the contrary, both Ag and Cu films attached on Si substrates showed an increase in (100) and (110) textures. Four anomalous large grains with same (211) orientation were observed in attached Cu films after annealing by TEM. The experimental results have been explained satisfactorily from anisotropy of surface energy and strain energy.