Abstract

At nanoscale along with the failure of Metal oxide semiconductor field-effect transistor due to short channel effects, Silicon has raised as another bottleneck for researchers. In the last couple of decades, researchers have provided different solutions in the form of Graphene and Transition Metal Dichalcogenides materials. Each Graphene and Transition Metal Dichalcogenides has its own set of disadvantages like poor ION/IOFF ratio and lower carrier mobility and hence cannot be used individually. In this article, a tub type metal oxide semiconductor field-effect transistor is designed and for application of the device in a low power VLSI domain, the back-gated technique is used. Different device properties are studied first with a Silicon-based channel and then a Silicon-Tungsten Disulphide heterojunction channel. The selection of SiO2 as a gate insulator and contact material is also justified. This article shows that instead of using conventional Silicon-based devices it is better to use heterojunction devices, as they offer much lower OFF-state current and better linearity properties.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.