Abstract
Chlorine (Cl2 or BCl3, with additions of Ar or N2), fluorine (SF6/Ar) and methane/hydrogen (CH4/H2/Ar or CH4/H2/N2) based plasmas have been examined as a function of composition, source and sample chuck power, and pressure, for dry etching of the typical luminescent sulphide phosphors (ZnS, SrS), conductive electrode materials [indium tin oxide, (ITO) and TiW] and insulators (Al2O3, alumina/titania-ATO) used in thin film electroluminescent displays. It is necessary to have both a high ion flux and an ion energy above a particular threshold (typically ⩾125 eV) in order to achieve practical etch rates for the high bond strength materials such as Al2O3, alumina/titania and SrS. The fastest etch rates for ZnS, Al2O3 and aluminum tin oxide are obtained with Cl2/Ar for SrS with SF6/Ar and for ITO with CH4/H2/Ar.
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