Abstract
Achieving well-defined multilayer structure is a key to improve device performance of organic light-emitting diodes (OLEDs), especially in solution-processed OLEDs. Use of cross-linkable hole-transporting materials (HTMs) is therefore gaining much attention to achieve such multilayer structures. One of representative solution-processable HTM is TFB, poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-(4,4'-(N-(4-sec-butylphenyl)diphenylamine)], but it does not have any cross-linkable units in its chemical structures. In this work, we performed basic physical characterization of a new cross-linkable HTM, HL-X026, and we also investigated its OLED characteristics. Actual solvent resistance by varying the thermal curing temperatures was measured. The thermally cross-linkable HL-X026 showed better device performances than simple TFB with higher luminance and efficiencies.
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