Abstract
The tensile properties of Sn–8 mass % Zn–3 mass % Bi and Sn–58 mass % Bi low-melting lead-free solders were investigated and compared with those of a Sn–Pb eutectic solder. The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is approximately double that of the Sn–Pb solder at room temperature (RT). The ductility of each solder is inferior to that of the Sn–Pb solder. From the results of strain-rate-change tests, the stress exponents and the activation energies for creep of Sn–58Bi and Sn–8Zn–3Bi were also examined.
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