The effect of temperature and strain rate on the tensile properties of a Sn 99.3Cu 0.7(Ni) lead-free solder alloy

Abstract

In this paper, the effect of temperature and strain rate of the lead-free solder alloy Sn 99.3Cu 0.7(Ni) was investigated. Tensile properties of this lead-free solder Sn 99.3Cu 0.7(Ni) at various temperatures and strain rates were determined and compared with those of the typical Pb-containing solder Sn 63Pb 37. During tensile tests of different temperatures and strain rates, the ultimate tensile strength (UTS) and 0.2% yield stress of the lead-free solder alloy Sn 99.3Cu 0.7(Ni) decreased with increasing test temperatures and decreasing strain rate. It was noted that mechanical properties of Sn99.3Cu0.3(Ni) showed strong temperature dependence and strain rate sensitivity in the tensile tests of various temperatures and strain rates. Temperature and strain rate impacted rigorously flowing behaviors of the lead-free solder Sn 99.3Cu 0.7(Ni) in the course of tensile deformation. The microstructure and fracture morphology of the lead-free solder Sn 99.3Cu 0.7(Ni) were analyzed by scanning electron microscope (SEM). In the SEM micro-graph of the fracture surface of this lead-free solder specimen tested, it was noted that increasing temperature affected the microstructure and morphology of fracture surface.